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Bismaleimide/Phenolic/Epoxy Ternary Resin System for Molding Compounds in High-Temperature Electronic Packaging Applications | Industrial & Engineering Chemistry Research
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Modern advances in bismaleimide resin technology: A 21st century perspective on the chemistry of addition polyimides - ScienceDirect
Bismaleimide - an overview | ScienceDirect Topics
Bismaleimide/Phenolic/Epoxy Ternary Resin System for Molding Compounds in High-Temperature Electronic Packaging Applications | Industrial & Engineering Chemistry Research
4: General structure of a bismaleimides indicating some of the types of... | Download Scientific Diagram
Beyond Epoxy: High Performance Thermosets Part Two - Bismaleimide Cure Chemistry - Polymer Innovation Blog
Fabrication of modified bismaleimide resins by hyperbranched phenyl polysiloxane and improvement of their thermal conductivities - RSC Advances (RSC Publishing)
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